COOLER: COM-FAN01 Heatspreader: PER-A122 Unit: mm Block Diagram Dimension Unit: mm COM-QM77 Rev. B Remark: Wide temperature criteria does not apply to Audio function. If audio function is required, please select industrial grade audio codec IC for design and apply thermal solution. Ordering Information Part Number COM Express Type Chipset CPU Memory Display LVDS Storage LAN USB UART Expansion Slot Power Temp. COM-QM77-B11 6 (COM.0 Rev.2.0) QM77 3rd Generation Intel® Core™ i7- 3555LE/2.5 GHz (FCBGA1023) DDR3 SODIMM x 2 up to 16 GB CRT, LVDS, DDI x 2 24b, 2CH SATA x 4 GbE x 1 USB3.0 x 4 USB2.0 x 8 2 (Tx/Rx) PCI-E [16] x 1,PCI-E [1] x 7 12V 0°C ~ 60°C COM-QM77-B11-01 6 (COM.0 Rev.2.0) QM77 3rd Generation Intel® Core™ i7- 3517UE/1.7 GHz (FCBGA1023) DDR3 SODIMM x 2 up to 16 GB CRT, LVDS, DDI x 2 24b, 2CH SATA x 4 GbE x 1 USB3.0 x 4 USB2.0 x 8 2 (Tx/Rx) PCI-E [16] x 1, PCI-E [1] x 7 12V 0°C ~ 60°C COM-QM77-B11-02 6 (COM.0 Rev.2.0) HM76 3rd Generation Intel® Core™ i3- 3217UE/1.6 GHz (FCBGA1023) DDR3 SODIMM x 2 up to 16 GB CRT, LVDS, DDI x 2 24b, 2CH SATA x 4 GbE x 1 USB3.0 x 4 USB2.0 x 8 2 (Tx/Rx) PCI-E [16] x 1, PCI-E [1] x 7 12V 0°C ~ 60°C COM-QM77W1-B11 6 (COM.0 Rev.2.0) QM77 3rd Generation Intel® Core™ i7- 3555LE/2.5 GHz (FCBGA1023) DDR3 SODIMM x 2 up to 16 GB CRT, LVDS, DDI x 2 24b, 2CH SATA x 4 GbE x 1 USB3.0 x 4 USB2.0 x 8 2 (Tx/Rx) PCI-E [16] x 1, PCI-E [1] x 7 12V WiTAS 1 (-20°C ~ 70°C) ROW A/B DDR3 SO-DIMM * 2 Channel A/ B USB 2.0 * 8 PCIe FDI USB 3.0 * 4 PEG [x16] TYPE 6 ROW C/D RGB ITE IT8518 GPIO SMBus SPI LPC COM Port * 2 PCIe[x1] * 7 Intel GbE Ethernet WG82579LM GBE DDI 1 3th Generation Intel® Core i3/i5/i7 Processors DMI TPM (Option) HD Audio SATA * 4 18/24bit LVDS 2CH I2C BIOS SPI DDI 2 Intel® PCH/QM77 www.aaeon.com Note: All specifications are subject to change without notice.