10 www.aaeon.com Note: All specifications are subject to change without notice. Features Specifications Industrial Motherboards IMBM-H61B Micro-ATX Board with Intel® 3rd/2nd Generation Core™ i7/i5/i3 Processor, COM x 13 & USB x 8 LVDS & Backlight Control Mini-Card COM x 8 (Box Header) ATX DDR3 1066/1333 MHz DIMM x 2 ATX 12V COM x 3 (Box Header) PCI x 2 USB 2.0 x 4 PCI-E 2.0 [x16] USB 2.0 x 4 COM x 2 (RS-232) PS/2 Port (Keyboard & Mouse) Gigabit Ethernet x 2 Audio x 1 VGA x 2 DIO SATA 3.0 Gb/s x 3 ■ Intel® Socket 1155 for 2nd/3rd Generation Core™ i7/i5/i3 Processor ■ Intel® H61 Express Chipset ■ DDR3 1066/1333 MHz DIMM x 2, Up to 16 GB ■ Realtek RTL8111F x 2, Gigabit Ethernet x 2 ■ Realtek ALC887 ■ VGA x 2, LVDS Dual Independent Displays ■ COM x 13, USB 2.0 x 8, SATA 3.0 Gb/s x 3, CFast™ x 1 ■ PCI-E [x16] x 1, PCI x 2, Mini-Card x 1 Packing List • 14001-00400100 COM Cable (9P, 260MM, p=2.54mm) w/bracket • I/O Shield • 14001-00700100 SATA 3G Cable (7P, 180; 90, 500mm) 2 in 1 • I/O Shield • Product CD • IMBM-H61B Optional Accessories • 1709100330 USB 2.0 cable (9P, 330MM, p=2.54mm, w/bracket) • 170910020K USB 2.0 cable (9P, 200MM, p=2.54mm, w/o bracket) • 1701260305 LPT Cable (25P, 270MM) • 175921156B CPU Cooler (2-Ball, Push-pin Type) • 1759200172 CPU Cooler (2-Ball, Screw with Retention Plate) • 1709070800 SATA Cable System Processor Intel® 3rd/ 2nd Generation Core™ i7/i5/i3/Pentium®/ Celeron® 22nm LGA 1155 Processors Chipset Intel® H61 Express Chipset Memory 240-pin DIMM x 2, max. 16GB, DDR3 1333/1066/800 MHz, non-ECC, un- buffered memory, Dual channel memory architecture I/O Chipset Fintech 81866D (5 COM), Fintech 81216HD (8 COM) x 2 Ethernet Realtek RTL8111F Giga LAN x 2 Audio Realtek ALC887 TPM — Expansion Slots PCIe 2.0[x16] Slot x 1, PCI x 2, Half Size Mini-Card x 1 BIOS 64Mbit Flash ROM, AMI BIOS H/W Monitor Temperature Monitor on CPU/Chassis, Voltage Monitor on Vcore/5V/3.3V/12V, Fan Monitor on CPU/Chassis WatchDog Timer 1~255 steps by software program Smart Fan Control CPU Fan/ Chassis Fan Wake On LAN/ PXE Yes (WOL/PXE) Power State S3, S4, S5 Graphics Graphics Chipset Intel® HD Graphics Graphics Multi Display VGA_1+LVDS, VGA1+VGA2, LVDS+VGA2 VGA Up to 1920 x 1200 @75Hz DVI — HDMI — Display Port — LVDS Up to 1920 x 1200 @60 Hz eDP — Backlight Control Voltage/ PWM Environment & Power & ME Battery Lithium battery Power Requirement 24-pin ATX connector x 1, 4-pin ATX 12V Power connector x 1 Operating Temperature 32°F ~ 140°F (0°C ~ 60°C) Storage Temperature -40°F ~ 185°F (-40°C ~ 85°C) Operating Humidity 0% ~ 80% RH , non-condensing Certificate CE & FCC Class A Form Factor Micro-ATX Form Factor, 9.6” x 9.6” (244mm x 244mm) Weight 1.55 lb (0.7 Kg) MTBF (Hours) — Rear Panel I/O Ports USB USB 2.0 port x 4 Display I/O VGA x 2 Audio I/O Audio Jack x 3: Line-in, Mic-in, Line-out LAN I/O LAN (RJ-45) port x 2 Serial Port RS232 DB-9 connector x 2 PS/2 Port PS/2 Keyboard Connector x 1, PS/2 Mouse Connector x 1 Others — Internal I/O Connectors Storage SATA2 (3.0Gb/s) connector x 3, CFast™ Socket x 1 USB USB 2.0 connector x 2 supports additional USB port x 4 Display I/O LVDS x 1 Audio I/O — Serial Port RS-232/422/485 box header x 2 (COM4 & COM9, COM 4 supports 5V/12V/RI option), RS-232 box header x9 (COM3, COM5~8, COM10~13) PS/2 Port — Parallel Port LPT connector x 1, SPP/EPP/ECP mode support DIO 8-bit Digital I/O interface x 1 (In/Out programmable) FAN CPU Fan connector(s) (4-pin) x 1, Chassis Fan connector(s) (4-pin) x 2 (Fan2 optional) Others Front panel header x 1, Clear CMOS jumper x 1, BIOS flash header (2[x4]P p=1.27mm) x 1 OS OS Support Windows® XP 32-bit, Windows® 7 32/64-bit, Linux Fedora