08 www.aaeon.com Note: All specifications are subject to change without notice. Features Specifications ECB-970 Qseven Rev. 2.0 Carrier Board for ARM/x86 Solutions System X86 (A10) ARM (A10-01) Form Factor Micro ATX I/O Chipset — — Ethernet 10/100/1000Base-TX, RJ-45 x 1 (From CPU module) Expansion Interface PCI-E [x4] x 1(For Super I/O Card only), LPC Connector x 1 PCI-E [x1] x 1 Power Requirement +5V DC +5V DC Power Consumption (Typical) — 3~5 Watt @5V Board Size 9.65" x 9.65" (243.84mm x 243.84mm) Gross Weight 1.32 lb (0.6 kg) Operation Temperature 32°F ~ 140°F (0°C ~ 60°C) Storage Temperature -40°F ~ 185°F (-40°C ~ 85°C) Operation Humidity 0% ~ 90% relative humidity, non-condensing MTBF (Hours) 75,000 Display LVDS or EDP, DP or HDMI DVI/CRT — — LVDS 18-bit Single Channel LVDS 24-bit Dual-Channel LVDS DDI — LVDS x 2, eDP x 2, HDMI x 1 I/O Storage SATA x 2, SDIO x 1 SATA 2 x 1 Serial Port RS-232 x 1, RS-232/422/485 x 1 One, For debug only Parallel Port — — USB USB 2.0 x 8, USB 3.0 x 2 USB 2.0 x 5( one shared with USB OTG) PS/2 Port — — I2C — 1 Audio Line-out, Microphone Headphone Debug LED Port 80 — UART VGA LVDS EDP Audio HDMI USB 2.0 x 4 USB 2.0 x 2 USB OTG(Micro USB) RJ-45 x 1 Display Port USB 3.0 x 2 ATX SMBUS CANbus LPC SATA x 2 MXM Fan Connector PCIe SIO * Above function support will vary by different Q7 CPU modules or Platforms ■ Supports Qseven Module ■ Supports Both ARM/x86 Based Q7 CPU module ■ Gigabit Ethernet, RJ-45 x 1 ■ Up to 18-bit Single Channel LVDS Connector, VGA (for X86) ■ Up to 24-bit Dual-Channel LVDS Connector or EDP, DP or HDMI (for ARM) ■ High Definition Audio (for X86), I2S Audio Interface (for ARM) ■ SATA Port x 2, SDIO x 1 (for X86), SATA Port x 1 (for ARM) ■ USB 2.0 x 8, USB 3.0 x 2 (for X86), USB 2.0 x 5 (Shared One USB OTG) ■ Qseven Specification 2.0 ■ LPC Connector x 1, Micro-ATX Form Factor Packing List • PER-T289 (PCI-E[x4] to PCI-E[x1]) Converter Board • 1701090150 COM Port Cable x 2 • 1709070500 SATA Cable x 2 • Product CD • ECB-970 Qseven CPU Modules