w w w. ie iwo r l d . co m Designing a system using extended temperature components is the most effective method to ensure reliable functionality in an extreme temperature range is met 1. Placement & layout A PCB with good placement & layout helps SBC or system reduce heat. 2. Thermal Simulation To develop a thermal design with thermal simulation and air flow design is a more effective way to ensure a reliable thermal solution. 3. Infrared Thermography Detects infrared energy emitted from an object, converts it in to a temperature, and displays an image of the temperature distribution. NEC TVS-G100EXD ► Test Process -40ºC ~ 85ºC Wide Temperature Product -20ºC ~ 60ºC Standard Prodct Pass About IEI-2017-V10 IEI Designs Process for Wide Temperature Products Model KINO-DALW2 NANO-ALW2 NANO-BTW2 WAFER-BTW2 iQ7-ALW2 iQ7-BTW2 ICE-BTW2-T10 Size 170mm x 170mm 115mm x 165mm 115mm x 165mm 146mm x 102mm 70mm x 70mm 70mm x 70mm 84mm x 55mm Memory 2 x DDR3L SO-DIMM slot Max. 8GB 1 x DDR3L SO-DIMM slot Max. 8GB 1 x DDR3L SO-DIMM slot Max. 8GB 2GB onboard (4GB optional) 4GB onboard (8GB optional) 2GB onboard (4GB optional) 2GB onboard (4GB optional) Display 1 x HDMI 1 x LVDS 1 x VGA 2 x HDMI 1 x LVDS 1 x iDP 1 x HDMI 1 x LVDS 1 x VGA 1 x iDP 1 x LVDS 1 x VGA 1 x DDI (DP/HDMI) 1 x eDP/LVDS 1 x DDI (DP/HDMI) 1 x LVDS 1 x DDI (DP/HDMI) 1 x eDP 1 x VGA I/O 4 x USB 3.0 4 x RS-232 2 x USB 2.0 2 x RS-232/422/485 1 x PS/2 KB/MS 4 x USB 3.0 4 x RS-232 2 x USB 2.0 2 x RS-232/422/485 1 x PS/2 KB/MS 3 x USB 2.0 3 x RS-232 1 x USB 3.0 1 x RS-422/485 1 x PS/2 KB/MS 6 x USB 2.0 3 x RS-232 1 x USB 3.0 1 x RS-422/485 1 x PS/2 KB/MS 6 x USB 2.0 1 x USB 3.0 6 x USB 2.0 1 x USB 3.0 4 x USB 2.0 1 x USB 3.0 Storage 1 x microSD 2 x SATA 6Gb/s 2 x SATA 6Gb/s 1 x microSD 2 x SATA 3Gb/s 1 x microSD 1 x mSATA 2 x SATA 3Gb/s 1 x 8GB eMMC 5.0 (optional) 2 x SATA 6Gb/s 1 x 4GB SSD (optional) 2 x SATA 3Gb/s 1 x 4GB SSD (optional) 2 x SATA 3Gb/s Expansion 1 x M.2 (B Key) 1 x PCIe Mini 1 x PCIe x1 1 x M.2 (B Key) 1 x PCIe Mini 1 x PCI/104 1 x PCIe Mini 2 x PCIe Mini 4 x PCIe x1 3 x PCIe x1 3 x PCIe x1 KINO-DALW2 NANO-ALW2 NANO-BTW2 WAFER-BTW2 iQ7-BTW2 iQ7-ALW2 ICE-BTW2-T10 IEI Extreme Environment Series Selection Guide To meet -40°C~ 85°C, the critical components must have the best reliability. IEI reviews critical components, such as CPU, chipset, SD-RAM, Ethernet IC, clock generator, super IO, EC, PWM IC, transceiver, switch, bridge, hubs, etc. Component specification review Thermal solution design It ensures the system‘s reliability under extreme operating environments. Testing criteria: 1. Wide temperature cycle chamber 2. Operating temperature: -40ºC ~ 85ºC 3. Passmark® burn-in test at 100% loading and power on-off test Wide temperature testing before shipment